Bonset America Corp. Secures Booth for PackExpo International 2016

Bonset America Corporation is pleased to announce we have secured a booth for Pack Expo International in 2016. Come see us at booth number 5284 in the Containers and Materials Pavilion located in the North Upper Hall.

November 6 – 9, 2016

McCormick Place, Chicago, Illinois USA

In 2016, PACK EXPO International will be world’s largest processing and packaging event. Along with co-located Pharma EXPO, PACK EXPO International will bring together:

  • 50,000 attendees from 40+ vertical markets
  • 7,000 international buyers from 130+ countries
  • More than 2,300 exhibiting companies
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