Bonset America at PACK EXPO Int’l, Chicago, IL, Oct 18-21st.

Sunday, October 18, 2026: 9:00 am – 5:00 pm
Monday, October 19, 2026: 9:00 am – 5:00 pm
Tuesday, October 20, 2026: 9:00 am – 5:00 pm
Wednesday, October 21, 2026: 9:00 am – 3:00 pm

Bonset America is excited to announce its exhibition at PACK EXPO International 2026. We invite you to visit our team in “West Hall — Booth W-47112” in the Containers and Materials Pavilion.

We will be showcasing BONPET® shrink films for labeling and SANZIP® press to close zippers for flexible packaging applications.

Visit the PACK EXPO INTERNATIONAL website for details.